‘Soldering’ with a laser

Thijs Beckers @ elektormagazine.com writes about a new experimental method of connecting electronics components together using a laser beam.

Researchers from the University of Saarland have, together with colleagues from Helsinki, discovered a new material which can connect electronic components together using a chemical method. Multiple very thin layers (1000x thinner than a human heir) of aluminum and ruthenium are placed on top of each other. When an intense laser beam is pointed at it, a large amount of heat is released in the nanometer thin layer and a homogeneous layer of ruthenium-aluminide is formed.

This brief heat can reach a temperature of 2000 °C. With this, components close together can be connected to each other without the addition of solder. The ruthenium-aluminide forms a layer between the components, just like solder does.

‘Soldering’ with a laser – [Link]

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