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Shipping to strategic customers, the CH-201 MEMS-based ultrasonic Time-of-Flight (ToF) sensor offers an extended sensing range of 5 metres. [via]
This ToF sensor uses a tiny ultrasonic transducer chip that sends a pulse of ultrasound and then listens for echoes returning from targets in the sensor’s field-of-view. TDK’s MEMS ultrasonic technology leverages a proprietary ToF sensor in a 3.5×3.5mm package that combines a MEMS ultrasonic transducer with a power-efficient digital signal processor (DSP) on a custom low-power, mixed-signal CMOS ASIC. The sensor handles a variety of ultrasonic signal-processing functions, enabling customers’ flexible industrial design options for a broad range of use-case scenarios including range-finding, presence/proximity sensing, object detection/avoidance and 3D position-tracking. The devices operates from ultra-low power, supporting always-on sensing in battery powered devices.
TDK – www.tdk.com
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