Tag: 3D Image Sensor
![Teledyne e2v’s Hydra3D Sensor Pushing the Boundaries of 3D Imaging and Distance Measurement Teledyne e2v’s Hydra3D Sensor Pushing the Boundaries of 3D Imaging and Distance Measurement](https://www.electronics-lab.com/wp-content/uploads/2023/02/Hydra3D-high-resolution-ToF-sensor-1024x693.jpg)
Teledyne e2v’s Hydra3D Sensor Pushing the Boundaries of 3D Imaging and Distance Measurement
A time-of-flight sensor (ToF) is a range imaging camera system for measuring distances between the camera and the subject for each point of the image based on time-of-flight, the round trip time of an artificial light signal, as provided by a laser or an LED. Teledyne e2v Hydra3D+ is...
Continue Reading![ArduCam Brings Out New ToF Camera Module for Raspberry Pi ArduCam Brings Out New ToF Camera Module for Raspberry Pi](https://www.electronics-lab.com/wp-content/uploads/2022/10/Arducam-ToF-Cam-1-1024x612.jpg)
ArduCam Brings Out New ToF Camera Module for Raspberry Pi
ArduCam is back with yet another camera module for Raspberry Pi with an active Time-of-Flight (ToF) sensor for an enhanced 3D Imaging experience. ArduCam’s new ToF camera for Raspberry Pi is now open for crowdfunding on Kickstart with a discounted price of $29.99, and a planned retail...
Continue Reading![Brookman Technology develops a three-dimensional range image sensor for up to 30 meters Brookman Technology develops a three-dimensional range image sensor for up to 30 meters](https://www.electronics-lab.com/wp-content/uploads/2022/06/Time-of-Flight-Sensor.jpg)
Brookman Technology develops a three-dimensional range image sensor for up to 30 meters
Japanese communications and embedded device manufacturer, Brookman Technology, collaborated on using a hybrid Time-of-Flight method developed by Prof. Shoji Kawahito of Shizuoka University. The collaboration has led to the (as claimed) "world's first" next-generation 3D Time-of-Flight...
Continue Reading![Flexx2 3D Development Kit offers an improved depth-sensing performance Flexx2 3D Development Kit offers an improved depth-sensing performance](https://www.electronics-lab.com/wp-content/uploads/2022/02/Flexx2-Development-Kit.png)
Flexx2 3D Development Kit offers an improved depth-sensing performance
pmdtechnologies announces its next-generation 3D time-of-flight (ToF) development kit, the flexx2. Thanks to the collaboration of PMD Technologies with the California-based, hardware/software specialist, Emcraft Systems, to deliver better depth-sensing performance with 38,000 3D pixels...
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