Latest TySOM Kit Accelerates the Development of AI
AIFPGA

Latest TySOM Kit Accelerates the Development of AI

Aldec’s TySOM-3A-ZU19EG embedded system development board, showcased at Embedded World 2019, supports the early co-development and co-verification of hardware and software. Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC...

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Gyrfalcon Launches Second-Gen AI Accelerator Chip
IC

Gyrfalcon Launches Second-Gen AI Accelerator Chip

Lightspeeur 2803 - a follow on to the Lightspeeur 2801S ASIC - enables upgrading of existing data center hardware to speed AI processing while providing 10X reduction in energy consumption. Gyrfalcon Technology Inc. (GTI), the world’s leading developer of low-cost, low-power,...

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MMC3630KJ – Magnetic sensor in BGA package
Sensor

MMC3630KJ – Magnetic sensor in BGA package

MEMSIC has announced the MMC3630KJ magnetometer that integrates a monolithic 3-axis AMR (anisotropic magnetoresistive) sensor and a signal conditioning ASIC into a 1.2 × 1.2 × 0.5-mm BGA package. According to MEMSIC, devices in the series offer the ability to deliver a magnetic...

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