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Tag: cooling
New Advanced Graphite Embedding Capability for PCB Thermal Management
New innovation provides weight savings for applications where size, weight and power (SWaP) are key Teledyne Labtech announces a major new capability allowing the embedding of layers of synthetic graphite within RF and microwave printed circuit boards (PCBs). Heat management is a...
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Bürklin Elektronik offers premium miniature fan units from Fischer Elektronik
Leading international distributor Bürklin Elektronik offers a premier range of miniature fan units to meet the increasing demands of small, high-performance electronic components. The LAM K series from Fischer Elektronik comprises miniature fan units to dissipate large amounts of heat...
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Pod Bay 3’s PiRyte Brings ATX Power and Active Cooling to the Raspberry Pi Family
Overheating and the resulting drop in performance and throughput has been one of the major drawbacks associated with using the Raspberry Pi. Several solutions have been developed to provide active or passive cooling solutions for it. One of the most recent solutions is the third...
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Imec Invented Unique Cost-effective Cooling For High-Performance Chips
Imec, the distinguished Belgian research center has invented a new and cost-effective method of cooling chips. This achievement can be an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems. Present powerful electronic systems have...
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ICECool – An Intra-Chip Cooling System That Is More Efficient
In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks have their limits, due to overheating. Researchers from IBM have solved this problem by developing an intra-chip...
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Researchers Developed New Efficient, Thin, and Flexible Cooling Device
Engineers and scientists from the UCLA Henry Samueli School of Engineering and Applied Science and SRI International, California, have created a thin flexible device that could keep smartphones and laptop computers cool and prevent overheating. The component is based on...
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Hot rods keep the die cool
Clemens Valens @ elektormagazine.com shows us a new IC Package that keeps the IC cool. Texas Instruments’ HotRod QFN is a thermally enhanced plastic package with solder lands on all sides as well as power buses for enhanced current carrying capability. Inside the package the die...
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