Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon
ICTechnology

Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon

Toshiba will start mass production of 64-layer 3D NAND, BiCS3, with 3-bit-per-cell technology and a 64GB capacity in the first half of 2017. The applications of this new massive storage chip include enterprise and consumer SSD, smartphones, tablets and memory cards. This achievement...

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The cheapest ESP8266 programmer!
Arduino

The cheapest ESP8266 programmer!

Gustavo Reynaga shows us how to you can flash your ESP-01 and esp-201 with Arduino IDE and upload any other firmware with ESP flash tools. Hi folks, now I'll teach you how to make your programmer to the ESP-01 and ESP-201, (perhaps serve with other models) using an Arduino UNO, a...

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ESP8266 superfast flashing: flash ESP in 5 seconds
Mcu

ESP8266 superfast flashing: flash ESP in 5 seconds

Deomid Ryabkov introduces us a method of flashing ESP8266 in 5 sec. To achieve that he used a modified ESPTool. More details on the link below. If you are developing for ESP8266, you may be familiar with esptool, which is a tool that you use to upload your code to the device. And it...

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WireFrame FPGA Board , Breadboardable Xilinx XC3S250E Board
Mcu

WireFrame FPGA Board , Breadboardable Xilinx XC3S250E Board

circuitvalley.com has build a small FPGA board based on Xilinx  XC3S250E : I have built a little FPGA board Xilinx xc3s250e called WireFrame. the board is only 500mm x 25 mm in size and it is possible to put it breadboard. board has 32MByte SDRAM, 4MByte serial Flash for storage....

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Toshiba launches 256-Gbit 48-layer 3-D NAND flash
IC

Toshiba launches 256-Gbit 48-layer 3-D NAND flash

by Susan Nordyk @ edn.com: Ready for sampling in September, Toshiba’s 48-layer BiCS (Bit Cost Scalable) flash memory stores 256 Gbits using a 3-D vertically stacked cell structure and 3-bit-per-cell triple-level cell technology. By employing this 48-layer vertical stacking process,...

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