Tag: Intrinsyc
![Qualcomm SDA845 SoC-Based Module Targets Drone Designs Qualcomm SDA845 SoC-Based Module Targets Drone Designs](https://www.electronics-lab.com/wp-content/uploads/2019/10/845-usom-side.png)
Qualcomm SDA845 SoC-Based Module Targets Drone Designs
Intrinsyc Technologies announced the Open-Q 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019. The Open-Q 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50 mm x...
Continue Reading![Intrinsyc Announces New Premium-Tier System on Module based on Qualcomm Technologies’ SDA845 System on Chip Intrinsyc Announces New Premium-Tier System on Module based on Qualcomm Technologies’ SDA845 System on Chip](https://www.electronics-lab.com/wp-content/uploads/2019/10/intrinsyc_openq845usom.jpg)
Intrinsyc Announces New Premium-Tier System on Module based on Qualcomm Technologies’ SDA845 System on Chip
Designed for use in Advanced Robotics and Drones, Premium Camera Applications, Artificial Intelligence Platforms, and other Cutting-edge IoT Devices. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of...
Continue Reading![Intrinsyc Announces Immediate Availability of the Open-Q™ 820Pro High-Performance System on Module Intrinsyc Announces Immediate Availability of the Open-Q™ 820Pro High-Performance System on Module](https://www.electronics-lab.com/wp-content/uploads/2019/06/intrinsyc_openq820prousom.jpg)
Intrinsyc Announces Immediate Availability of the Open-Q™ 820Pro High-Performance System on Module
High-performance edge computing module for use in a variety of consumer and industrial IoT Devices Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability...
Continue Reading![Intrinsyc Announces Open-Q™ 212A SOM and Development Kit based on the Qualcomm® Home Hub 300 Platform Intrinsyc Announces Open-Q™ 212A SOM and Development Kit based on the Qualcomm® Home Hub 300 Platform](https://www.electronics-lab.com/wp-content/uploads/2019/05/212A-SOM-front-web-lrg.jpg)
Intrinsyc Announces Open-Q™ 212A SOM and Development Kit based on the Qualcomm® Home Hub 300 Platform
Designed for next-gen home hub products requiring advanced audio and multi-mode wireless capabilities, including Wi-Fi, Bluetooth, BLE, and Zigbee. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things...
Continue Reading![Tiny, octa-core Arm module (Qualcomm SDA660) targets AI on the edge Tiny, octa-core Arm module (Qualcomm SDA660) targets AI on the edge](https://www.electronics-lab.com/wp-content/uploads/2019/03/Open-Q-660.png)
Tiny, octa-core Arm module (Qualcomm SDA660) targets AI on the edge
Designed for use in 4K Cameras, Gaming, Digital Signage, and other Consumer and Industrial IoT Devices. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the...
Continue Reading![Qualcomm Launches 10nm, octa-core QCS605 IoT SoC Qualcomm Launches 10nm, octa-core QCS605 IoT SoC](https://www.electronics-lab.com/wp-content/uploads/2018/11/open-q-605-SBC-back_2048x2048.jpg)
Qualcomm Launches 10nm, octa-core QCS605 IoT SoC
Qualcomm announced back in April its QCS605 SoC, calling it "the first 10nm FinFET fabricated SoC, built for the Internet of Things." The octa-core Arm SoC is available in an Intrinsyc Open-Q 605 SBC with full development kit, including a 12V power supply which is available for...
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