REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution
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REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution

Infineon Technologies AG is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in...

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