Tag: LGA
![iWave Systems launches i.MX 8M Plus OSM Module: A Solderable System-On-Module iWave Systems launches i.MX 8M Plus OSM Module: A Solderable System-On-Module](https://www.electronics-lab.com/wp-content/uploads/2022/01/1-2.png)
iWave Systems launches i.MX 8M Plus OSM Module: A Solderable System-On-Module
Building on the new industry standard “Open Standard Module (OSM)” defined by SGeT, iWave Systems launches iW-RainboW-G40M: The solderable i.MX 8M Plus OSM LGA Module. iW-RainboW-G40M integrates the powerful i.MX 8M Plus processor in the compact OSM 1.0 standard, delivering powerful...
Continue Reading![SMART Wireless launches a new SoM based on Snapdragon™ 660 SMART Wireless launches a new SoM based on Snapdragon™ 660](https://www.electronics-lab.com/wp-content/uploads/2020/05/snapdragon66.jpg)
SMART Wireless launches a new SoM based on Snapdragon™ 660
SMART Wireless Computing® (part of SMART Global Holdings), a leading provider of Snapdragon™ embedded computing platforms and solutions, today announced a compact compute module in an LGA package, Inforce 6503. Inforce 6503 enables advanced visual computing, enhanced graphics,...
Continue Reading![New TQ module based on ARM® Cortex®-A53 with i.MX8M Mini and Nano technology New TQ module based on ARM® Cortex®-A53 with i.MX8M Mini and Nano technology](https://www.electronics-lab.com/wp-content/uploads/2020/05/TQMa8MXML_schraeg-1024x682.jpg)
New TQ module based on ARM® Cortex®-A53 with i.MX8M Mini and Nano technology
The technology company TQ is expanding its i.MX8 product range with the new embedded module TQMa8MxML based on the i.MX8M Mini and Nano CPU family. It supports all nine CPU derivatives of the two families on the small LGA module and all signal pins are available in every...
Continue Reading![TechNexion XORE is a tiny NXP i.MX 8M Mini LGA System-on-Module TechNexion XORE is a tiny NXP i.MX 8M Mini LGA System-on-Module](https://www.electronics-lab.com/wp-content/uploads/2019/09/TechNexion-XORE-LGA-System-on-Module.jpg)
TechNexion XORE is a tiny NXP i.MX 8M Mini LGA System-on-Module
There are several ways to design a system-on-module to carrier board interface, one method is to design an LGA (Land Grid Array) module, which have to be soldered straight unto the carrier board, and enables much more compact system-on-modules, and that’s exacty what TechNexion has...
Continue Reading![IDT Announces High Performance MEMS Relative Humidity & Temperature Sensor IDT Announces High Performance MEMS Relative Humidity & Temperature Sensor](https://www.electronics-lab.com/wp-content/uploads/2018/02/IDTs_Humidity_Sensor_HS300x-Eval-kit_LCD-1.jpg)
IDT Announces High Performance MEMS Relative Humidity & Temperature Sensor
California based company, Integrated Device Technology (IDT) has recently announced their new HS300x family of MEMS high-performance relative humidity (RH) and temperature sensors of dimension 3.0 × 2.41 × 0.8 mm DFN-style 6-pin LGA. Currently, there are four devices in this...
Continue Reading