Tag: NAND
![SK Hynix Introduces Industry’s Highest 72-Layer 3D NAND Flash SK Hynix Introduces Industry’s Highest 72-Layer 3D NAND Flash](https://www.electronics-lab.com/wp-content/uploads/2017/05/2339132271188911.jpg)
SK Hynix Introduces Industry’s Highest 72-Layer 3D NAND Flash
SK Hynix Incorporated introduced the world's first 72-Layer 256Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies. This company also launched 6-Layer 128Gb 3D NAND chips in April 2016 and has been mass producing 48-Layer 256Gb...
Continue Reading![Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon](https://www.electronics-lab.com/wp-content/uploads/2016/08/Toshiba-64-bit-layer.jpg)
Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon
Toshiba will start mass production of 64-layer 3D NAND, BiCS3, with 3-bit-per-cell technology and a 64GB capacity in the first half of 2017. The applications of this new massive storage chip include enterprise and consumer SSD, smartphones, tablets and memory cards. This achievement...
Continue Reading![Toshiba launches 256-Gbit 48-layer 3-D NAND flash Toshiba launches 256-Gbit 48-layer 3-D NAND flash](https://www.electronics-lab.com/wp-content/uploads/2015/08/Toshiba-BiCS.jpg)
Toshiba launches 256-Gbit 48-layer 3-D NAND flash
by Susan Nordyk @ edn.com: Ready for sampling in September, Toshiba’s 48-layer BiCS (Bit Cost Scalable) flash memory stores 256 Gbits using a 3-D vertically stacked cell structure and 3-bit-per-cell triple-level cell technology. By employing this 48-layer vertical stacking process,...
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