Tag: Qualcomm
![Qualcomm’s RB3 Gen 2 Development Kit: Advanced IoT Development Platform Qualcomm’s RB3 Gen 2 Development Kit: Advanced IoT Development Platform](https://www.electronics-lab.com/wp-content/uploads/2024/06/RB3-Gen-2.jpg)
Qualcomm’s RB3 Gen 2 Development Kit: Advanced IoT Development Platform
The Qualcomm® RB3 Gen 2 Development Kit is the latest iteration in the RB3 series, designed to enhance performance and accessibility for IoT development. Powered by the advanced Qualcomm® QCS6490 Chipset, this kit offers a significant upgrade over its predecessor, with substantial...
Continue Reading![Avnet’s QCS6490 Development Kit for Vision AI Edge Applications Avnet’s QCS6490 Development Kit for Vision AI Edge Applications](https://www.electronics-lab.com/wp-content/uploads/2024/05/N1A1221_stacked_768x432.jpg)
Avnet’s QCS6490 Development Kit for Vision AI Edge Applications
Avnet recently released a development kit for its Small Mobility ARChitecture (SMARC) 2.1.1 compute module which uses Qualcomm’s QCS6490 processor–the QCS6490 Vision-AI Development Kit. Equipped with high-performance cores within the SMARC module and provision pins for multiple...
Continue Reading![Noni Radio Module: Unlocking WiFi-7 Connectivity with Qualcomm’s Chipsets Noni Radio Module: Unlocking WiFi-7 Connectivity with Qualcomm’s Chipsets](https://www.electronics-lab.com/wp-content/uploads/2024/04/Noni-1-1024x735.png)
Noni Radio Module: Unlocking WiFi-7 Connectivity with Qualcomm’s Chipsets
The Noni module, powered by Qualcomm’s QCA9274/QCA6274 chipsets, revolutionizes wireless connectivity with advanced WiFi-7 capabilities packed into a versatile M.2 A+E form factor. Tailored for a diverse range of applications, this module thrives in both commercial and industrial...
Continue Reading![Introducing Mini Pini: A Powerful Wi-Fi 6 Module with OpenWrt Support Introducing Mini Pini: A Powerful Wi-Fi 6 Module with OpenWrt Support](https://www.electronics-lab.com/wp-content/uploads/2024/04/Mini_Pini_top-heat-sink.jpg)
Introducing Mini Pini: A Powerful Wi-Fi 6 Module with OpenWrt Support
The Mini Pini emerges as a cutting-edge Wi-Fi 6 radio module engineered to effectively tackle the challenges of demanding wireless environments. Leveraging Qualcomm's advanced QCN9074/72 chipset, this product promises efficient and reliable wireless performance across various...
Continue Reading![Revolutionizing Wireless Connectivity: Exploring the Compex WLE7002E25 WiFi 7 Mini PCIe Module Revolutionizing Wireless Connectivity: Exploring the Compex WLE7002E25 WiFi 7 Mini PCIe Module](https://www.electronics-lab.com/wp-content/uploads/2024/03/Screenshot-2024-03-14-214114.png)
Revolutionizing Wireless Connectivity: Exploring the Compex WLE7002E25 WiFi 7 Mini PCIe Module
The Compex WLE7002E25 is a WiFi 7 module designed in a standard mini PCIe form factor, ensuring compatibility with existing systems using WiFi 4 or WiFi 5 modules. This compatibility simplifies integration for device manufacturers, as they do not need to modify their hardware to...
Continue Reading![Qualcomm introduces 10G Fiber Gateway platform to support high-performance Wi-Fi 7 Qualcomm introduces 10G Fiber Gateway platform to support high-performance Wi-Fi 7](https://www.electronics-lab.com/wp-content/uploads/2023/09/Qualcomm-10G-Fiber-Gateway-Platform-Chip.jpg)
Qualcomm introduces 10G Fiber Gateway platform to support high-performance Wi-Fi 7
Qualcomm has developed a new product called the 10G Fiber Gateway platform that is designed to improve the performance of home broadband services. The solution combines high-performance Wi-Fi 7 and service-defined Wi-Fi technology to offer customizable services to subscribers. Unlike...
Continue Reading![Qualcomm expands its S3 Gen2 Sound Platform to deliver high-quality audio experiences Qualcomm expands its S3 Gen2 Sound Platform to deliver high-quality audio experiences](https://www.electronics-lab.com/wp-content/uploads/2023/09/Qualcomm-S3-Gen-2-Sound-Platform.jpg)
Qualcomm expands its S3 Gen2 Sound Platform to deliver high-quality audio experiences
Qualcomm has announced the expansion of the S3 Gen2 Sound Platform, which includes a set of audio technologies and hardware components that focus on delivering high-quality audio experiences. This expanded portfolio is specifically designed for the use in dongles and adapter, which are...
Continue Reading![Qualcomm Technologies introduces two modem chipsets for remote monitoring Qualcomm Technologies introduces two modem chipsets for remote monitoring](https://www.electronics-lab.com/wp-content/uploads/2023/07/Qualcomm-212S-and-9205S-Modem-Chipsets.png)
Qualcomm Technologies introduces two modem chipsets for remote monitoring
Qualcomm Technologies has launched the 212S Modem and the Qualcomm 9205S Modem chipsets with satellite capability for remote monitoring and asset tracking for Internet of Things (IoT) devices. These modems are developed in collaboration with Skylo to offer low-power and advanced...
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