Tag: Samsung
![Exynos 9 series applications processor has deep learning based software Exynos 9 series applications processor has deep learning based software](https://www.electronics-lab.com/wp-content/uploads/2018/03/Exynos-9810_main_1.jpg)
Exynos 9 series applications processor has deep learning based software
The new Exynos 9810 brings premium features with a 2.9GHz custom CPU, an industry-first 6CA LTE modem and deep learning processing capabilities Samsung Electronics, a world leader in advanced semiconductor technology, today announced the launch of its latest premium application...
Continue Reading![512Gbyte embedded universal flash memory in production 512Gbyte embedded universal flash memory in production](https://www.electronics-lab.com/wp-content/uploads/2017/12/2017-12-11-eenews-jh-samsung.jpg)
512Gbyte embedded universal flash memory in production
Samsung Electronics has begun mass production of what the company claims to be the industry’s first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution for use in next-generation mobile devices. by Julien Happich @ eenewseurope.com: The 512GB eUFS packs eight of...
Continue Reading![A 5nm GAAFET Chip By IBM, Samsung & GlobalFoundries A 5nm GAAFET Chip By IBM, Samsung & GlobalFoundries](https://www.electronics-lab.com/wp-content/uploads/2017/06/20170606145203_GAAFETs.jpg)
A 5nm GAAFET Chip By IBM, Samsung & GlobalFoundries
In less than two years since making a 7nm test node chip with 20 billion transistors, scientists have paved the way for 30 billion switches on a fingernail-sized chip. IBM with its Research Alliance partners, GlobalFoundries and Samsung, have unveiled their industry-first process that...
Continue Reading![Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon](https://www.electronics-lab.com/wp-content/uploads/2016/08/Toshiba-64-bit-layer.jpg)
Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon
Toshiba will start mass production of 64-layer 3D NAND, BiCS3, with 3-bit-per-cell technology and a 64GB capacity in the first half of 2017. The applications of this new massive storage chip include enterprise and consumer SSD, smartphones, tablets and memory cards. This achievement...
Continue Reading![Samsung launches industry’s first 12Gb LPDDR4 DRAM Samsung launches industry’s first 12Gb LPDDR4 DRAM](https://www.electronics-lab.com/wp-content/uploads/2015/09/5-samsunglaunc-e1443600281734.jpg)
Samsung launches industry’s first 12Gb LPDDR4 DRAM
by Samsung: Samsung Electronics announced that it is mass producing the industry's first 12-gigabit (Gb) LPDDR4 (low power, double data rate 4) mobile DRAM, based on its advanced 20-nanometer (nm) process technology. The newest LPDDR4 is expected to significantly accelerate the...
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