Tag: TO-247

3D printed liquid cooled heatsinks cool down TO-247 transistors
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3D printed liquid cooled heatsinks cool down TO-247 transistors

Standard Transistor Cooler Made by 3D-printing using SLM (Selective Laser Melting) A very effective way to dissipate the high heat flux densities of electronic power modules or power devices with high power density is the use of micro-coolers or micro-channel heat sinks made by SML....

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CoolSiC™ MOSFET 650 V family offers best reliability and performance to even more applications
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CoolSiC™ MOSFET 650 V family offers best reliability and performance to even more applications

Infineon Technologies AG continues to expand its comprehensive silicon carbide (SiC) product portfolio with 650 V devices. With the newly launched CoolSiC™ MOSFETs Infineon is addressing the growing demand for energy efficiency, power density, and robustness in a wide range of...

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