Tiny compute modules features Snapdragon 845 and Snapdragon 660

– Inforce 6701

A production ready micro SoM based on Snapdragon™ 845 SoC architected for Artificial Intelligence and Immersion

The compact sized Inforce 67X1 SOM’s multiple MIPI-CSI interfaces and on-device artificial intelligence (AI) allows users to capture cinema-grade videos and blur the lines between physical and virtual worlds. The product’s enhanced hardware and software capabilities bring high-performance, true-to-life cinematic video capture, with 64x more high-dynamic range color information for video capture and playback on Ultra HD Premium displays, compared to the previous generation. This massive boost in color information includes 10-bit color depth for over one billion shades of colors that can be displayed to the wide Rec. 2020 gamut for brilliant 4K/Ultra HD @60 fps videos. The Adreno GPU enables room-scale 6 degrees of freedom (6DoF) with simultaneous localization and mapping (SLAM)—for features such as wall-collision detection. Snapdragon 845 also introduces “Adreno foveation,” which substantially reduces power consumption, improves visual quality and boosts XR application performance, as compared to the previous generation. All these features make it ideal for manufacturers to develop SWaP constrained devices in the immersive multimedia space, wearables, portable healthcare and connected cameras’ domain.

The Snapdragon 845 platform has processor advancements that offer an improved user experience

• Qualcomm Kryo 385 CPU: Manufactured in 2nd gen 10nm LPP, optimized across 4 performance and 4 efficiency cores for higher performance.
• Hexagon™ 685 DSP: Designed to support supports sophisticated, on-device AI processing, delivering richer camera, voice, XR and gaming experiences.
• Adreno™ 630 VPS: Featuring room-scale 6DoF with SLAM, Adreno Foveation, and significantly improved graphics rendering and video processing, the Visual Processing Subsystem(VPS) comprising the GPU, VPU and DPU provides a larger-than-life immersive experience. It includes support for Vulkan 2/OpenGL ES 3.2/OpenCL.
• Dual 14-bit Spectra™ 280 ISPs support up to 16MP each for simultaneous concurrent cameras
• Qualcomm® AI Engine: The 3rd generation AI Platform enables on-device intelligence and simplifies how you take pictures and videos. It also enables enhanced features like camera bokeh, more true to life XR, gaming, and long lasting battery life. The Snapdragon core hardware architectures are engineered to run AI applications quickly and efficiently.

Specifications

Based on the Snapdragon™ 845 processor (SDA845) manufactured in 10nm FinFET process technology

• Customized Kryo™ ARMv8 compliant 64-bit Octa-core CPUs arranged in two dual-clusters, running at 2.8GHz (Gold) and 1.8GHz (Silver) each
• Adreno™ 630 VPS with 64 bit addressing and designed for significantly improved graphics and efficient rendering as compared to the previous generation
• Hexagon™ 685 DSP with dual-Hexagon vector processor designed for on-device AI processing, low-power audio, XR/gaming and computer vision processing
• Spectra™ 280 camera (dual) Image Signal Processors (ISPs) to support up to 24MP single or 16MP@60 fps dual cameras

PROCESSING POWER, MEMORY, AND STORAGE

• Qualcomm® Snapdragon™ 845 (SDA845 SoC) processor
• 4GB on-board LPDDR4X RAM
• 64GB UFS ROM
• 1x µSD card v3.0 interface
• USB-C on USB 3.1/gen1 + USB-SS
• Intelligent scalable power management for superior energy efficiencies through PMIC

AUDIO, VIDEO, INTERFACE, AND CONNECTIVITY

• Audio Lineout; Mic-In
• UltraHD (4K) display on USB-C
• H.265 (HEVC)/H.264 (AVC)/VP9 playback & capture @4K60 fps
• Concurrent 4K60 10b encode + 4K60 10b decode
• Dual MIPI-CSI cameras up to 16MP@60fps
• 4-lane MIPI-DSI capability
• Multiple BLSPs for UART/I2C/SPI/GPIOs
• 802.11n/ac 2X2 MU-MIMO 2.4GHz/5GHz WiFi & BT/LE 5.x via WCN3990
• GPS/GLONASS via SDR660G
• 1x 1-lane PCIe Gen 2 and 1x 1-lane PCIe Gen 3
• Audio Lineouts, HPH and Mic-In from integrated PMIC codec

POWER, MECHANICAL, AND ENVIRONMENTAL

• Power: +3.8V/6A Input
• Dimensions: 50mm x 28mm
• Operating Temp: -20C to +85 C (Extended Temp SKU)
• Storage Temp: -20 to 85 C
• Relative Humidity: 5 to 95% non-condensing
• RoHS and WEEE compliant

– Inforce 6502

A production ready micro SoM based on Snapdragon™ 660 SoC with stereoscopic depth sensing and deep Learning capabilities

The compact sized Inforce 6502 SOM offers multiple MIPI-CSI interfaces with which depth perception use-cases like proximity detection, semantic segmentation, autonomous driving and facial recognition can be enabled with ease on a system built with this product. The product’s enhanced hardware and software capabilities for on-camera deep learning and video analytics, 4K HEVC video encoding and advanced features for robust hardware-based security make it ideal for manufacturers to develop SWaP constrained devices in the wearables, portable healthcare and connected cameras’ domain including bodycams and IP security cameras.

The Snapdragon 660 platform has processor advancements that offer an improved user experience

• Qualcomm Kryo 260 CPU: Higher performance with independent efficiency and power clusters, each designed to optimize for a unique UX
• Hexagon™ 680 DSP: Vector eXtensions (HVX) designed to support Caffe2 and Tensorflow for machine learning and image processing
• Adreno™ 512 GPU: Vulkan/OpenGL ES 3.2/OpenCL support and lifelike visuals coupled with efficient rendering of advanced 3D graphics
• Dual 14-bit Spectra™ 160 ISPs support up to 16MP each for simultaneous concurrent cameras
• Qualcomm® AI Engine: The Snapdragon core hardware architectures are engineered to run AI applications quickly and efficiently.

Specifications

Based on the Snapdragon™ 660 processor (SDA660) manufactured in 14nm FinFET process technology

• Customized Kryo™ ARMv8 compliant 64-bit Octa-core CPUs arranged in two dual-clusters, running at 2.2GHz (Gold) and 1.8GHz (Silver) each
• Adreno™ 512 GPU with 64 bit addressing and designed for upto 30% better graphics and efficient rendering as compared to Adreno 506
• Hexagon™ 680 DSP with dual-Hexagon vector processor (HVX-512) designed for 787MHz for low-power audio and computer vision processing
• Spectra™ 160 camera (dual) Image Signal Processors (ISPs) to support up to 24MP single or 16MP dual cameras

PROCESSING POWER, MEMORY, AND STORAGE

• Qualcomm® Snapdragon™ 660 (SDA660 SoC) processor
• 3GB on-board LPDDR4 RAM
• 32GB eMMC ROM
• 1x µSD card v3.0 interface
• USB-C on USB 3.1/gen1 + USB-HS
• Intelligent scalable power management for superior energy efficiencies through PMIC

AUDIO, VIDEO, INTERFACE, AND CONNECTIVITY

• UltraHD (4K) display on USB-C
• H.265 (HEVC)/H.264 (AVC)/VP9 playback & capture @4K30
• Dual MIPI-CSI cameras up to 16MP
• 4-lane MIPI-DSI with FullHD+ capability
• Multiple BLSPs for UART/I2C/SPI/GPIOs
• 802.11n/ac 2X2 MU-MIMO 2.4GHz/5GHz WiFi & BT/LE 5.x via WCN3990
• GPS/GLONASS via SDR660G
• Audio Lineouts, HPH and Mic-In from integrated PMIC codec

POWER, MECHANICAL, AND ENVIRONMENTAL

• Power: +3.3V/6A Input
• Dimensions: 50mm x 28mm
• Operating Temp: -20C to +85 C (Extended Temp SKU)
• Storage Temp: -20 to 85 C
• Relative Humidity: 5 to 95% non-condensing
• RoHS and WEEE compliant

More information

The Inforce 6701 and Inforce 6502 modules are available now. The Inforce 6701 sells for $285 or $300 (extended temp) and the Inforce 6502 lists only the $208 commercial temp SKU, both in single quantities. The SoM +ACC-1C20 Carrier is available as the IFC6701-00-P1 (6701) and IFC6502-00-P1 (6502) Reference Designs and sell for $600 and $500, respectively. It’s unclear what the prices are for the other Inforce 6502 carrier boards.

More information may be found in the Inforce 6701 product and shopping pages, as well as the Inforce 6502 product and shopping pages.

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