TI’s EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging

Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply.

Texas Instruments (TI) introduced the first integrated circuit (IC) developed with a new proprietary integrated transformer technology: a 500-mW high-efficiency isolated DC/DC converter with the industry’s lowest electromagnetic interference (EMI), the UCC12050. Its 2.65-mm height enables designers to reduce their solution volume by as much as 80% compared to discrete solutions and 60% compared to power modules – with twice the efficiency of competing devices. Built for industrial performance, the UCC12050’s 5-kVrms reinforced isolation and 1.2-kVrms working voltage protect against high-voltage spikes in systems such as industrial transport, grid infrastructure and medical equipment.

TI’s breakthrough integrated transformer technology enables high-density isolated DC/DC power conversion, while maintaining low EMI. The single-package, surface-mount architecture gives designers an easy-to-use, low-profile IC that reduces the bill of materials (BOM), and efficiently operates across a wide temperature range. An EMI-optimized, low capacitance transformer and quiet control scheme streamline EMI compliance while providing a reliable solution with options for reinforced or basic isolation.

Key features and benefits of the UCC12050

• Small size, increased power density:
  Available in a 16-pin small-outline integrated circuit (SOIC) package measuring 10.3 mm by 10.3 mm by 2.65 mm, the UCC12050 offers 60% efficiency – twice that of competing devices of similar size – and twice the power density of comparative isolated power modules. Delivering 0.5 W in the new architecture improves reliability, enables a small BOM and simplifies board layout.
• Ultra-low EMI:
  The UCC12050’s integrated transformer with very low primary-to-secondary capacitance is optimized for EMI performance, and its quiet control scheme makes it easier for engineers to have their designs pass Comité International Spécial des Perturbations Radioélectriques (CISPR) 32 Class B EMI tests, with margin, on a two-layer printed circuit board. The solution also eliminates external filter components such as low-dropout regulators and ferrite beads normally required to meet EMI certification, which significantly reduces component selection and design time.
• Reinforced isolation, wide temperature range:
  The UCC12050’s reinforced isolation with 8-mm creepage and clearance is used for protection and robustness against ground potential differences. Its high efficiency and extended –40 °C to 125 °C operating temperature range deliver more power in extreme conditions.

This new high-density isolated power converter, the latest industry-leading device in TI’s power-management portfolio, offers small size and ease of use for any industrial application requiring isolation. Additionally, the new UCC12040 provides all of the same benefits with 3-kVrms basic isolation.

Package, availability and pricing

The UCC12050 and UCC12040 are available in volume production from TI and authorized distributors in a 16-pin, 10.3-mm-by-10.3-mm-by-2.65-mm SOIC package. Pricing starts at US$3.90 and US$3.15, respectively, in 1,000-unit quantities. Engineers can evaluate this product with the UCC12050EVM-022 evaluation module, available on TI.com for US$99.

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