![Wide-Temp SMARC Module with Qualcomm QCS610 SoC Wide-Temp SMARC Module with Qualcomm QCS610 SoC](https://www.electronics-lab.com/wp-content/uploads/2023/03/IBASE_RM-QCS610_image.jpg)
IBASE Technology Inc., a global leader in the manufacture of embedded computing products, has launched the new RM-QCS610 SMARC 2.1 compliant module powered by an Octa-core Qualcomm QCS610 SoC and designed for the creation of devices with edge artificial intelligence (AI) and machine learning capabilities such as vision-enhanced drones, advanced intelligent conferencing cameras, and smart robots.
“The low cost, low power RM-QCS610 offers high performance for devices with edge AI capabilities that have grown in popularity in the last few years,” explained Albert Lee, Executive Vice President at IBASE. “The module is our first Qualcomm-based platform. It provides flexible I/O interfaces and brings powerful visual edge computing to accelerate AI across devices with sensors or cameras to collect and process information, make decisions, and perform tasks in the same location in applications including traffic data collection and analysis, computer vision in manufacturing, and automated security validation.”
RM-QCS610 FEATURES:
- Qualcomm QCS610 SoC
- Up to 4GB LPDDR4,32GB eMMC
- Qualcomm Adreno 612 GPU 3D graphics accelerator with 64-bit addressing 845 MHz
- 4K video capture and playback at 30fps
- 3.15 TOPS @Caffe
- Validated with Open Linux Embedded 5.4 and Android 12 (2023/2, CS)
- Long lifetime supply with Qualcomm solution
- Compliant with SMARC™ 2.1
The RM-QCS610 features a Qualcomm Adreno 612 GPU 3D graphics accelerator with 4K video capture and 30fps playback support, up to 4GB LPDDR4, 32GB eMMC, and dual smart camera operation. Built to withstand harsh environments, it supports a wide-range operating range of from -30°C to +85°C. Aside from offering reliability and longevity in supply, the module has passed the OS validation procedure with Open Linux Embedded 5.414.04 and Android 12 (2023/2, CS). The RP-105 carrier board is available for the expansion of Micro SD, Mini PCI-E, TTL, HDMI, MIPI-DSI, and MIPI-CSI cameras.
The RM-QCS610 and RP-105 will be demonstrated at Avalanche Computing’s booth #R214 during the upcoming Smart City Summit & Expo, held from March 28-31, 2023 in Taipei, Taiwan. With the automatic programming and interface design developed by Avalanche Computing’s AI software, the RM-QCS610 helps achieve optimal computing performance with SaaS cloud management and reduces AI development time for faster time-to-market.
more information: https://www.ibase.com.tw/en/product/category/RISC_Platform/SMARC_Module/QUALCOMM_SMARC_2_1_Module/RM_QCS610