Würth Elektronik’s WE-FNCS Targets Low-Frequency EMI Shielding

Würth Elektronik’s WE-FNCS Targets Low-Frequency EMI Shielding

Würth Elektronik expands its EMC lineup with thin, flexible nanocrystalline sheets that suppress magnetic interference from 10 Hz to 120 MHz.

Components Passives Power by Electronics-Lab Staff
Waveshare RP2350-USB-C – A Compact Dev Board with Dual USB-C Ports

Waveshare RP2350-USB-C – A Compact Dev Board with Dual USB-C Ports

Powered by the Raspberry Pi RP2350A MCU, this tiny castellated module features 2MB flash, 15 GPIOs, and a PIO-driven Type-C connector for flexible host or device applications.

IoT Microcontrollers by Debashis Das
Sixfab AI HAT+ Delivers Up to 25 TOPS Edge AI for Raspberry Pi 5

Sixfab AI HAT+ Delivers Up to 25 TOPS Edge AI for Raspberry Pi 5

Powered by DEEPX NPUs, this new expansion board provides local vision AI processing over PCIe, eliminating cloud dependency while keeping power consumption low.

Raspberry Pi by Debashis Das
indie’s iND881 Brings Edge AI to Automotive and Robotic Cameras

indie’s iND881 Brings Edge AI to Automotive and Robotic Cameras

The iND881 SoC pairs a low-latency ISP with an NPU and DSP for smart-camera perception in vehicles and humanoid robots.

AI / ML Automotive SoC / SiP by Electronics-Lab Staff
AOS Introduces IMVP9.3 Power Solution for Panther Lake and Wildcat Lake Mobile Processors

AOS Introduces IMVP9.3 Power Solution for Panther Lake and Wildcat Lake Mobile Processors

New AOS multiphase controllers cut power draw to 5.9mA, boosting battery life for Panther Lake and Wildcat Lake mobile processors.

Processors by Sayantan Nandy

SparkPNT GNSS Disciplined Oscillator Delivers Sub-Nanosecond Timing
Control Data Centers by Sayantan Nandy
u-blox Launches MAYA-W5 and NORA-W5 Wi-Fi 6 Module Families
Components IoT RF / Wireless by Electronics-Lab Staff
PZSDR P047 SDR Board Packs AMD ZU47DR RFSoC and 8×8 RF Channels
FPGA RF / Wireless SoC / SiP by Sayantan Nandy
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Efinix Ti125 FPGA Targets Compact, Power-Sensitive Edge AI

Efinix Ti125 FPGA Targets Compact, Power-Sensitive Edge AI

The Ti125 packs 123K logic elements, sub-milliwatt static power, 2.5 Gbps MIPI I/O, and hardware SEU correction into a footprint as small as 5.5 × 5.5 mm.

AI / ML Embedded and Edge FPGA by Electronics-Lab Staff
Dragon Q8B Packs Edge AI, Dual 2.5GbE, and Triple 4K Output

Dragon Q8B Packs Edge AI, Dual 2.5GbE, and Triple 4K Output

Powered by Snapdragon 8cx Gen 3, the Dragon Q8B combines dual 2.5GbE, PCIe expansion, Wi-Fi 7 support, and up to 32GB RAM for edge AI applications.

Comm and Networking Embedded and Edge by Sayantan Nandy