Silicon Labs’ BG2B SoC Targets Ultra-Low-Power Bluetooth Designs

Silicon Labs’ BG2B SoC Targets Ultra-Low-Power Bluetooth Designs

A new Bluetooth 6 SoC combines channel sounding, hardware security, and integrated peripherals to reduce battery consumption in battery-powered IoT designs.


Edge AI Computer reComputer Mini J5011 Supports 8x GMSL2 Cameras

Edge AI Computer reComputer Mini J5011 Supports 8x GMSL2 Cameras

Seeed Studio’s Edge AI Computer features Jetson AGX Orin 32GB, 200 TOPS AI performance, 8x GMSL2 camera support, 10GbE, CAN, RS-485, and 48V input.


Siemens and ASU Launch Online PCB Design Microcredential Program

Siemens and ASU Launch Online PCB Design Microcredential Program

A new hands-on curriculum trains engineers on industry EDA tools to close the growing hardware design skills gap.


NXP RW610FML Module Brings Wi-Fi 6 and BLE 5.4 Connectivity

NXP RW610FML Module Brings Wi-Fi 6 and BLE 5.4 Connectivity

The RW610FML combines a 260 MHz Cortex-M33 MCU, dual-band Wi-Fi 6, BLE 5.4, 8 MB Flash, and advanced security in a compact module.


ESP32-C61-MINI-1 Brings Wi-Fi 6, BLE 5.3, and Matter Support

ESP32-C61-MINI-1 Brings Wi-Fi 6, BLE 5.3, and Matter Support

Espressif’s ESP32-C61-MINI-1 module combines a 160 MHz RISC-V MCU with Wi-Fi 6, Bluetooth LE 5.3, IEEE 802.15.4, and rich peripherals.


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Clintech Pico Board exposes all 48 RP2354B GPIOs in Pico-compatible design

Clintech Pico Board exposes all 48 RP2354B GPIOs in Pico-compatible design

Built around the RP2354B, this compact development board adds USB Type-C, QSPI expansion, and full 48-GPIO access while maintaining Raspberry Pi Pico compatibility.


AMD’s 6th Gen EPYC CPUs Split Server Duties for Agentic AI

AMD’s 6th Gen EPYC CPUs Split Server Duties for Agentic AI

The new EPYC lineup assigns distinct silicon to running agents, feeding accelerators, and handling everyday enterprise compute.